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dat a sheet product specification supersedes data of 2002 feb 05 2002 aug 06 discrete semiconductors BGA2709 mmic wideband amplifier dbook, halfpage mbd128
2002 aug 06 2 nxp semiconductors product specification mmic wideband amplifier BGA2709 features ? internally matched to 50 ? ? very wide frequency range (3.6 ghz at 3 db bandwidth) ? flat 23 db gain (dc to 2.6 ghz at 1 db flatness) ? 12.5 dbm saturated output power at 1 ghz ? high linearity (22 dbm oip3 at 1 ghz) ? unconditionally stable (k > 1.2). applications ? cable systems ? lnb if amplifiers ? general purpose ? ism. description silicon monolithic microwave integrated circuit (mmic) wideband amplifier with internal matching circuit in a 6-pin sot363 smd plastic package. pinning pin description 1v s 2, 5 gnd2 3rf out 4gnd1 6rf in mam455 13 2 4 1 63 2, 5 4 56 top view fig.1 simplified outline (sot363) and symbol. marking code: e3-. quick reference data limiting values in accordance with the absolute maximum rating system (iec 60134) symbol parameter conditions typ. max. unit v s dc supply voltage 5 6 v i s dc supply current 23.5 ? ma |s 21 | 2 insertion power gain f = 1 ghz 22.7 ? db nf noise figure f = 1 ghz 4 ? db p l(sat) saturated load power f = 1 ghz 12.5 ? dbm symbol parameter conditions min. max. unit v s dc supply voltage rf input ac coupled ? 6v i s supply current ? 35 ma p tot total power dissipation t s ? 90 ? c ? 200 mw t stg storage temperature ? 65 +150 ? c t j operating junction temperature ? 150 ? c p d maximum drive power ? 10 dbm caution this product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling.
2002 aug 06 3 nxp semico nductors product specification mmic wideband amplifier BGA2709 thermal characteristics characteristics v s =5v; i s =23.5ma; t j =25 ? c unless otherwise specified. symbol parameter conditions value unit r th j-s thermal resistance from junction to solder point p tot = 200 mw; t s ? 90 ? c300k/w symbol parameter conditions min. typ. max. unit i s supply current 19 23.5 32 ma |s 21 | 2 insertion power gain f = 100 mhz 21 22.2 23 db f = 1 ghz 21 22.7 24 db f = 1.8 ghz 22 23.0 24 db f = 2.2 ghz 21 23.0 24 db f = 2.6 ghz 20 22.1 23 db f = 3 ghz 18 21.1 22 db r l in return losses input f = 1 ghz 9 11 ? db f=2.2ghz 9 11 ? db r l out return losses output f = 1 ghz 17 20 ? db f = 2.2 ghz 20 24 ? db |s 12 | 2 isolation f = 1.6 ghz 31 33 ? db f = 2.2 ghz 34 36 ? db nf noise figure f = 1 ghz ? 4.0 4.4 db f=2.2ghz ? 4.4 4.9 db bw bandwidth at ? s 21 ? 2 ? 3 db below flat gain at 1 ghz 3.1 3.6 ? ghz k stability factor f = 1 ghz 1.3 1.7 ?? f=2ghz 1.8 2.2 ?? p l(sat) saturated load power f = 1 ghz 11 12.5 ? dbm f=2.2ghz 5 7.5 ? dbm p l 1 db load power at 1 db gain compression; f = 1 ghz 7 8.3 ? dbm at 1 db gain compression; f = 2.2 ghz 3 5.4 ? dbm ip3 (in) input intercept point f = 1 ghz ? 3 ? 1 ? dbm f=2.2ghz ? 7 ? 9 ? dbm ip3 (out) output intercept point f = 1 ghz 20 22 ? dbm f = 2.2 ghz 12 14 ? dbm
2002 aug 06 4 nxp semico nductors product specification mmic wideband amplifier BGA2709 application information figure 2 shows a typical application circuit for the BGA2709 mmic. the device is internally matched to 50 ? , and therefore does not need any external matching. the value of the input and output dc blocking capacitors c2, c3 should be not more than 100 pf for applications above 100 mhz. however, when the device is operated below 100 mhz, the capacitor value should be increased. the nominal value of the rf choke, l1 is 100 nh. at frequencies below 100 mhz this value should be increased to 220 nh. at frequencies above 1 ghz a much lower value must be used (e.g. 10 nh) to improve return losses. for optimal results, a good quality chip inductor such as the tdk mlg 1608 (0603), or a wire-wound smd type should be chosen. both the rf choke, l1 and the 22 nf supply decoupling capacitor, c1 should be located as closely as possible to the mmic. separate paths must be used for the ground planes of the ground pins gnd1, gnd2, and these paths must be as short as possible. when using vias, use multiple vias per pin in order to limit ground path inductance. figure 3 shows two cascaded mmics. this configuration doubles overall gain while preserving broadband characteristics. supply decoupling and grounding conditions for each mmic are the same as those for the circuit of fig.2. the excellent wideband characteristics of the mmic make it and ideal building block in if amplifier applications such as lbns (see fig.4). as a buffer amplifier between an lna and a mixer in a receiver circuit, the mmic offers an easy matching, low noise solution (see fig.5). in fig.6 the mmic is used as a driver to the power amplifier in part of a transmitter circuit. good linear performance and matched input and output offer quick design solutions in such applications. handbook, halfpage mgu436 rf out rf in c1 l1 c2 c3 gnd2 gnd1 v s v s rf input rf output fig.2 typical application circuit. handbook, halfpage dc-block 100 pf dc-block 100 pf dc-block 100 pf input output mgu437 fig.3 simple cascade circuit. handbook, halfpage from rf circuit to if circuit or demodulator mgu438 mixer oscillator wideband amplifier fig.4 if amplifier application. handbook, halfpage antenna to if circuit or demodulator mgu439 mixer oscillator lna wideband amplifier fig.5 rf amplifier application. handbook, halfpage from modulation or if circuit to power amplifier mgu440 mixer oscillator wideband amplifier fig.6 power amplifier driver application.
2002 aug 06 5 nxp semico nductors product specification mmic wideband amplifier BGA2709 handbook, full pagewidth mld894 0 0.2 0.6 0.4 0.8 1.0 1.0 +5 +2 +1 +0.5 +0.2 0 ?0.2 ?0.5 ?1 ?2 ?5 0.2 0.5 4 ghz 100 mhz 1 2 5 180 135 90 45 0 ?45 ?90 ?135 fig.7 input reflection coefficient (s 11 ); typical values. i s =23.5ma; v s =5v; p d = ? 30 dbm; z o =50 ?? handbook, full pagewidth mld895 0 0.2 0.6 0.4 0.8 1.0 1.0 +5 +2 +1 +0.5 +0.2 0 ?0.2 ?0.5 ?1 ?2 ?5 0.2 0.5 4 ghz 100 mhz 1 2 5 180 135 90 45 0 ?45 ?90 ?135 fig.8 output reflec tion coefficient (s 22 ); typical values. i s =23.5ma; v s =5v; p d = ? 30 dbm; z o =50 ??
2002 aug 06 6 nxp semico nductors product specification mmic wideband amplifier BGA2709 handbook, halfpage 0 1000 f (mhz) 2000 4000 0 ?50 ?10 3000 ?20 ?30 ?40 mld896 s 12 2 (dbm) fig.9 isolation (|s 12 | 2 ) as a function of frequency; typical values. i s =23.5ma; v s =5v; p d = ? 30 dbm; z o =50 ?? handbook, halfpage 0 f (mhz) (1) (3) (2) 25 20 15 10 1000 2000 4000 3000 mld897 s 21 2 (dbm) fig.10 insertion gain (|s 21 | 2 ) as a function of frequency; typical values. p d = ? 30 dbm; z o =50 ?? (1) i s =28.4ma; v s =5.5v (2) i s =23.5ma; v s =5v (3) i s =18.8ma; v s =4.5v handbook, halfpage 15 ?30 ?20 0 ?10 ?5 0 5 10 ?10 p d (dbm) p l (dbm) mld898 (1) (3) (2) fig.11 load power as a function of drive power at 1 ghz; typical values. f=1ghz; z o =50 ?? (1) v s =4.5v (2) v s =5v (3) v s =5.5v handbook, halfpage 15 ?30 ?20 0 ?10 ?5 0 5 10 ?10 p d (dbm) p l (dbm) mld899 (1) (3) (2) fig.12 load power as a function of drive power at 2.2 ghz; typical values. f=2.2ghz; z o =50 ?? (1) v s =4.5v (2) v s =5v (3) v s =5.5v
2002 aug 06 7 nxp semico nductors product specification mmic wideband amplifier BGA2709 handbook, halfpage 0 500 2500 5.5 5 4 3.5 4.5 1000 f (mhz) nf (db) 1500 2000 mld900 (1) (3) (2) fig.13 noise figure as a function of frequency; typical values. p d = ? 30 dbm; z o =50 ?? (1) i s =18.8ma; v s =4.5v (2) i s =23.5ma; v s =5v (3) i s =28.4ma; v s =5.5v handbook, halfpage 0 f (mhz) k 1000 2000 4000 10 0 8 3000 6 4 2 mld901 fig.14 stability factor as a function of frequency; typical values. i s =23.5ma; v s =5v; z o =50 ??
2002 aug 06 8 nxp semiconductors product specification mmic wideband amplifier BGA2709 table 1 scattering parameters: i s =23.5ma; v s =5v; p d = ? 30 dbm; z o =50 ? ; t amb =25 ? c f (mhz) s 11 s 21 s 12 s 22 k- factor magnitude (ratio) angle( deg) magnitude (ratio) angle (deg) magnitude (ratio) angle (deg) magnitude (ratio) angle (deg) 100 0.23362 32.281 12.90523 21.565 0.036496 16.408 0.16296 61.578 1.2 200 0.25252 11.824 13.22858 4.852 0.032314 5.728 0.13501 60.573 1.3 400 0.25838 ? 2.149 13.43580 ? 10.31 0.029604 ? 5.865 0.10353 41.717 1.3 600 0.25990 ? 8.784 13.51088 ? 21.14 0.027122 ? 11.45 0.085075 16.95 1.4 800 0.26278 ? 12.76 13.56715 ? 30.93 0.024611 ? 15.08 0.088892 ? 1.879 1.5 1000 0.26695 ? 14.88 13.65916 ? 40.37 0.022107 ? 16.33 0.09716 ? 13.36 1.7 1200 0.27404 ? 16.30 13.74736 ? 49.83 0.019986 ? 15.67 0.10279 ? 20.25 1.8 1400 0.27921 ? 16.51 13.85661 ? 59.47 0.018217 ? 13.42 0.10385 ? 23.24 1.9 1600 0.28486 ? 16.78 14.03414 ? 69.50 0.017049 ? 9.927 0.099148 ? 24.08 2.0 1800 0.28749 ? 17.25 14.16012 ? 80.23 0.016409 ? 5.968 0.089633 ? 20.58 2.1 2000 0.28601 ? 17.76 14.23586 ? 91.65 0.015912 ? 2.04 0.076785 ? 14.48 2.1 2200 0.27487 ? 18.98 14.14430 ? 10 3.9 0.015829 1.077 0.062455 ? 4.50 7 2.2 2400 0.25176 ? 19.94 13.70546 ? 117.0 0.016054 3.361 0.044552 11.808 2.2 2600 0.21405 ? 17.09 12.75365 ? 129.7 0.015801 3.145 0.023668 98.126 2.5 2800 0.19288 ? 11.85 11.96153 ? 138.7 0.015406 7.602 0.057779 104.35 2.7 3000 0.18347 ? 6.228 11.33015 ? 147.6 0.015049 11.411 0.094848 119.98 2.9 3200 0.17459 ? 6.327 10.94943 ? 156.3 0.015098 15.52 0.12948 123.28 3.0 3400 0.15344 ? 14.14 10.65459 ? 167.3 0.015529 20.649 0.15325 126.56 3.0 3600 0.10799 ? 26.12 10.28106 ? 179.1 0.017107 23.92 0.16627 131.67 2.8 3800 0.05984 ? 39.66 9.56897 170.0 0.018529 23.226 0.16317 140.54 2.8 4000 0.025953 ? 28.87 8.97718 157.3 0.019276 18.403 0.14602 157.03 2.9
2002 aug 06 9 nxp semico nductors product specification mmic wideband amplifier BGA2709 package outline references outline version european projection issue date iec jedec jeita sot363 sc-88 wb m b p d e 1 e pin 1 index a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 45 6 plastic surface-mounted package; 6 leads sot363 unit a 1 max b p cd e e 1 h e l p qy wv mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.45 0.15 0.25 0.15 a 1.1 0.8 04-11-08 06-03-16
2002 aug 06 10 nxp semico nductors product specification mmic wideband amplifier BGA2709 data sheet status notes 1. please consult the most recently issued document before initiating or completing a design. 2. the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest pr oduct status information is available on the internet at url http://www.nxp.com. document status (1) product status (2) definition objective data sheet development this document contains data from the objective specification for product development. preliminary data sheet qualification this document contains data from the preliminary specification. product data sheet production this document contains the product specification. definitions product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer, unless nxp semiconductors and customer have explicitly agreed otherwise in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semico nductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without lim itation - lost profits, lost savings, business interrup tion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semi conductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for incl usion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are fo r illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assi stance with ap plications or customer product design. it is customer?s sole responsibility to dete rmine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as for the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.
2002 aug 06 11 nxp semico nductors product specification mmic wideband amplifier BGA2709 nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applications and products using nxp semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will c ause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeat ed exposure to lim iting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the general terms and conditions of comme rcial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconductors products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick refere nce data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semiconductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semicond uctors? warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond nxp semiconductors? standard warranty and nxp semiconductors? product specifications.
nxp semiconductors provides high performance mixed signal and standard product solutions that leverage its leading rf, analog, power management, interface, security and digital processing expertise contact information for additional information please visit: http://www.nxp.com for sales offices addresses send e-mail to: salesaddresses@nxp.com ? nxp b.v. 2010 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liabilit y will be accepted by the publisher for any consequen ce of its use. publicat ion thereof d oes not con vey nor imply any license under patent- or other industrial or intellectual property rights. customer notification this data sheet was changed to reflect the new company name nxp semiconductors, including new legal definitions and disclaimers. no changes were made to the technical content, except for package outline drawings which were updated to the latest version. printed in the netherlands r77/02/pp 12 date of release: 2002 aug 06

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